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This study explores factors promoting and inhibiting advanced technology adoption in small- and medium-sized manufacturing firms (SMEs). With AI’s rapid advancement impacting productivity and efficiency across industries, understanding the challenges that SMEs face to remain competitive is crucial. Utilizing the Unified Theory of Acceptance and Use of Technology (UTAUT) model as a theoretical framework, we analyzed managers, engineers, and line workers’ observations on workforce challenges, training needs, and opportunities faced by SMEs to provide insights into their smart manufacturing deployment experiences. Our findings highlight social influence’s role in promoting technology adoption, emphasizing community, shared experiences, and collaborative networks. Conversely, effort expectancy emerged as the largest inhibitor, with concerns about the complexity, time, and resources required for implementation. Individuals were also influenced by factors of facilitating conditions (organizational buy-in, infrastructure, etc.) and performance expectancy on their propensity to adopt advanced technology. By fostering positive organizational environments and communities that share success stories and challenges, we suggest this can mitigate the perceived effort expected to implement new technology. In turn, SMEs can better leverage AI and other advanced technologies to maintain global competitiveness. The research contributes to understanding technology adoption dynamics in manufacturing, providing a foundation for future workforce development and policy initiatives. 

Abstract Digital transformation of manufacturing industry, Smart Manufacturing, leverages continuous measurement of machines on the shop floor to make effective decisions and improve productivity metrics such as machine uptime and overall equipment efficiency (OEE). However, despite the declining sensor cost, the initial financial and technological skill requirements of digital transformation pose significant barriers for the overwhelming majority (90%) of the manufacturers who are classed as small and medium enterprises (SMEs). To lower this barrier, here we demonstrate an inexpensive (~ $40 per machine), data-efficient solution that extracts part-level productivity metrics of a CNC machine from its total current consumption alone. We introduce the concept of a part’s “fingerprint” and develop a set of methods that allows one to extract the fingerprints and utilize them to monitor each individual manufactured part and their cycle times. Testing on actual production data of over 3 three months in a part-counting task, the algorithms show a good match (96.2% overall accuracy) with manually logged production data is achieved. The presented fingerprint framework is general: it can be extended to multi-sensors, and multi-modal analytics. We expect that such a simple, yet cost-effective, solution will be accessible for a wide range of discrete manufacturers, facilitating the beginning of their digital transformation journey. 

Detecting electronic hot spots is important for understanding the heat dissipation and thermal management of electronic and semiconductor devices. Optical thermoreflective imaging is being used to perform precise temporal and spatial imaging of heat on wires and semiconductor materials. We apply quantum squeezed light to perform thermoreflective imaging on micro-wires, surpassing the shot-noise limit of classical approaches. We obtain a far-field temperature sensing accuracy of 42 mK after 50 ms of averaging and show that a 256×256 pixel image can be constructed with such sensitivity in 10 min. We can further obtain single-shot temperature sensing of 1.6 K after only 10 μs of averaging, enabling a dynamical study of heat dissipation. Not only do the quantum images provide accurate spatiotemporal information about heat distribution but also the measure of quantum correlation provides additional information, inaccessible by classical techniques, which can lead to a better understanding of the dynamics. We apply the technique to both aluminum and niobium microwires and discuss the applications of the technique in studying electron dynamics at low temperatures. 

Smart manufacturing systems are considered the next generation of manufacturing applications. One important goal of the smart manufacturing system is to rapidly detect and anticipate failures to reduce maintenance cost and minimize machine downtime. This often boils down to detecting anomalies within the sensor data acquired from the system which has different characteristics with respect to the operating point of the environment or machines, such as, the RPM of the motor. In this paper, we analyze four datasets from sensors deployed in manufacturing testbeds. We detect the level of defect for each sensor data leveraging deep learning techniques. We also evaluate the performance of several traditional and ML-based forecasting models for predicting the time series of sensor data. We show that careful selection of training data by aggregating multiple predictive RPM values is beneficial. Then, considering the sparse data from one kind of sensor, we perform transfer learning from a high data rate sensor to perform defect type classification. We release our manufacturing database corpus (4 datasets) and codes for anomaly detection and defect type classification for the community to build on it. Taken together, we show that predictive failure classification can be achieved, paving the way for predictive maintenance. 

Roll-to-roll printing has significantly shortened the time from design to production of sensors and IoT devices, while being cost-effective for mass production. But due to less manufacturing tolerance controls available, properties such as sensor thickness, composition, roughness, etc., cannot be precisely controlled. Since these properties likely affect the sensor behavior, roll-to-roll printed sensors require validation testing before they can be deployed in the field. In this work, we improve the testing of Nitrate sensors that need to be calibrated in a solution of known Nitrate concentration for around 1–2 days. To accelerate this process, we observe the initial behavior of the sensors for a few hours, and use a physics-informed machine learning method to predict their measurements 24 hours in the future, thus saving valuable time and testing resources. Due to the variability in roll-to-roll printing, this prediction task requires models that are robust to changes in properties of the new test sensors. We show that existing methods fail at this task and describe a physics-informed machine learning method that improves the prediction robustness to different testing conditions (≈ 1.7× lower in real-world data and ≈ 5× lower in synthetic data when compared with the current state-of-the-art physics-informed machine learning method). 

Abstract In the modern industrial setting, there is an increasing demand for all types of sensors. The demand for both the quantity and quality of sensors is increasing annually. Our research focuses on thin-film nitrate sensors in particular, and it seeks to provide a robust method to monitor the quality of the sensors while reducing the cost of production. We are researching an image-based machine learning method to allow for real-time quality assessment of every sensor in the manufacturing pipeline. It opens up the possibility of real-time production parameter adjustments to enhance sensor performance. This technology has the potential to significantly reduce the cost of quality control and improve sensor quality at the same time. Previous research has proven that the texture of the topical layer (ion-selective membrane (ISM) layer) of the sensor directly correlates with the performance of the sensor. Our method seeks to use the correlation so established to train a learning-based system to predict the performance of any given sensor from a still photo of the sensor active region, i.e. the ISM. This will allow for the real-time assessment of every sensor instead of sample testing. Random sample testing is both costly in time and labor, and therefore, it does not account for all of the individual sensors. Sensor measurement is a crucial portion of the data collection process. To measure the performance of the sensors, the sensors are taken to a specialized lab to be measured for performance. During the measurement process, noise and error are unavoidable; therefore, we generated credibility data based on the performance data to show the reliability of each sensor performance signal at each sample time. In this paper, we propose a machine learning based method to predict sensor performance using image features extracted from the non-contact sensor images guided by the credibility data. This will eliminate the need to test every sensor as it is manufactured, which is not practical in a high-speed roll-to-roll setting, thus truely enabling a certify as built framework. 

We review the recent advances in thermal characterization of micro/nanoscale electronic, optoelectronic, thermal devices based on thermoreflectance imaging. Thermoreflectance imaging is a non-invasive optical technique that can visualize surface thermal response of devices and integrated circuits (IC). Recent advances of the technique have enabled high-resolution, ultra-fast transient thermal imaging with 800 ps temporal resolution. Using visible or UV illumination, spatial resolution of about 200-250 nm can be achieved. Many IC substrates, e.g. Si, GaAs, are transparent to near IR illumination in 1-1.5 μm wavelength range. Through-substrate thermal imaging of flip-chip bonded ICs with micron spatial resolution has been demonstrated. We provide key examples of various devices characterized by the technique such as CMOS ICs, GaN HEMT, nanowire transistors, thin-film solar cells, and micro-thermal cloaking devices. In addition to the validation of electrothermal models, material and fabrication defects can be identified. Finally we discuss the advantages/limitations, and perspective of thermoreflectance imaging technique.